On-Chip/Off-Chip Interconnect Design - Tenders Global

On-Chip/Off-Chip Interconnect Design

  • Contract
  • Germany
  • Posted 8 months ago

HM Hochschule München University of Applied Sciences

tendersglobal.net


18 Jan 2024
Job Information

Organisation/Company
HM Hochschule München University of Applied Sciences
Research Field
Computer science » Computer architecture
Researcher Profile
First Stage Researcher (R1)
Country
Germany
Application Deadline
30 Jun 2024 – 00:00 (UTC)
Type of Contract
To be defined
Job Status
Negotiable
Is the job funded through the EU Research Framework Programme?
Not funded by an EU programme
Is the Job related to staff position within a Research Infrastructure?
No

Offer Description

Hochschule München is among the largest German universities of applied sciences, located at the heart of Munich, Germany. The working group ”AEMY” focuses on safe, secure and smart systems. Our main working areas include RISC-V processor design, WebAssembly runtime development and open source chip design tools.

For our research projects we are looking for a qualified and motivated new team member. This position focuses on the evaluation and design of methods and tools for the design of optimized on-chip and off-chip interconnect of complex chiplet-based heterogeneous chip designs. You will be building on existing open source designs and tools flows and explore their extension to an open source hardware/software-codesign tool flow for novel architectures.

Your profile should cover:

  • Fundamental understanding of computer architecture
  • Basic understanding of digital chip design
  • Ideally some experience with interconnect design

Join us now:

  • to become a member of a great team in Munich, Germany
  • to be in the epicenter of RISC-V and open source chip design
  • to pursue a PhD degree at a small and focused research group
  • to be actively involved with relevant industry partners in the area

Requirements
Additional Information

Website for additional job details
https://www.hipeac.net/jobs/14503/on-chipoff-chip-interconnect-design/

Work Location(s)

Number of offers available
1
Company/Institute
HM Hochschule München University of Applied Sciences
Country
Germany
City
Munich
Geofield

Where to apply

E-mail
[email protected]

Contact

City
Munich
Website
https://www.youtube.com/user/HochschuleMuenchen1
https://www.hm.edu/en/
https://twitter.com/hmmuenchen
https://www.linkedin.com/school/hochschule-muenchen

STATUS: EXPIRED

View or Apply
To help us track our recruitment effort, please indicate in your email – cover/motivation letter where (tendersglobal.net) you saw this job posting.

Job Location