VAST Instructor – Semiconductor Packaging

Virginia Alliance for Semiconductor Technology (VAST) is a Commonwealth of Virginia initiative to innovate Virginia’s semiconductor, microelectronics, and nanotechnology ecosystem. VAST will establish an alliance of institutions of higher education to coordinate the semiconductor and nanofabrication cleanrooms, nano-characterization facilities, and advanced packaging and microelectronics centers across member institutions; to accelerate the development of a qualified workforce through a new Fast Track to Semiconductor Career program; and to market and promote the assets and infrastructure that supports the industry in the Commonwealth. VAST website will serve as the gateway to semiconductor and nanotechnology excellence in the Commonwealth. The VAST Headquarters will be at Virginia Tech Research Center (VTRC) in Arlington, and founding members of the alliance are: George Mason University (GMU), Virginia Tech (VT), University of Virginia (UVA), Virginia Commonwealth University (VCU), Norfolk State University (NSU). Each member may have more than one cleanroom or facility that participates in the network. Northern Virginia Community College will be a strategic partner for the workforce development and the Fast Track to Semiconductor Career programs.

VAST is looking for a qualified instructor for the Semiconductor Packaging and Characterization Certification to be conducted at Virginia Tech Research Center in Arlington. The certificate program, part of the VAST Fast Track to Semiconductor Careers, will consist of synchronous and asynchronous online lectures, daily office hours, and about 50 hours of hand-on training. Fast Track to Semiconductor Careers initiative is aimed at reskilling and upskilling military veterans and adult learners for the semiconductor and electronics industry sector by teaching them the principles of semiconductor packaging.

POSITION DUTIES AND RESPONSIBILITIES:
The instructor for the Semiconductor Packaging and Characterization certificate program for VAST is expected to develop and deliver online lectures, hands-on lab training, and hold office hours. The module topics include: package materials and fabrication processes, package characterization and testing, electrical package design, thermal package design, package reliability, and a semiconductor packaging project. The instructor will teach the program participants to use relevant design and simulation tools, and packaging and characterization equipment. The instructor will set up and oversee the hands-on lab training sessions and ensure proper and safe usage of the equipment, as well as proper handling and disposal of materials and chemicals. The packaging and characterization processes that will be taught in the hands-on lab may include substrate patterning, solder reflow, die bonding, wire bonding, shear and pull testing and thermal cycling. Other testing equipment that may be taught include curve tracer, impedance and network analyzers, and thermal analyzer.